北京AMD招聘Physical Design Engineer

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招聘职位: Physical Design Engineer (Beijing)

Location: Bei Jing

Responsibilities:

1. Work with global Front-End design team and physical design team for large scale ASIC chip physical implementation.

2. Physical design of deep sub-micron chips including block level floorplanning, place&route, cts, routing, physical verification, sta, si closure , power closure.

Qualification:

1. Master and above of EE.

2. Experience on place and routing, signal integrity, power analysis, CTS design, DFT, design rule and connectivity verification, sta.

3. Knowledgeable in all aspects of deep submicron ASIC design flow.

4. Familiar with Back-End (physical design) EDA tools.

5. Familiar with Front-End EDA tools or circuit design is a plus.

6. Familiar with Unix/Linux environment and good at scripts (tcl/perl).

7. Strong passion in achievement and career development.

8. Good English listening, writing and speaking ability.

9. Good communication skills, strong interpersonal skills and the flexibility. Dedicated, hard working and good team player.

Physical Design部门简介

AMD Physical Design 部门主要负责各种独立显卡芯片，集成显卡芯片，芯片组以及Fusion芯片的物理设计。

这个部门成立于2009年4月，在两年的时间里已经发展到将近60名成员。在过去的两年多里上海Physical Design部门同美国，加拿大，印度Physical Design部门合作，成功流片多种芯片。

AMD Physical Design部门的工作涵盖从网表到gds的各种领域，我们的目标是：

1.
掌握理解最先进的工艺以提高芯片质量。

2.
同全球物理设计部门合作以提高设计效率。

3.
同逻辑设计部门合作以提高芯片设计周期及质量。

4.
注重同事间的沟通及互助，建立一个透明，合作的工作环境。

申请方式:

一.
未网申者:

1. 在IE输入ht tp://w ww.amdcampus.c om/CampusRecruiting03.html找到此职位后点击职位右下方的”APPLY”按钮

2.注册新用户后即可进行网申

二.
己网申者:

1.在IE输入ht tp://w ww.amdcampus.c om/CampusRecruiting03.html找到此职位后点击职位右下方的”APPLY”按钮

2.输入用户名和密码进行网申(忘记用户名和密码者可选择”忘记密码”功能找回)

3.点击职位下方橙色按钮”修改职位”,将”第二申请职位”改成此职位即可